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HELIOS is designed for efficiency with ‘zero-waste’ processing, substantially lower factory power consumption and small footprint. A patented integrated abatement ensures minimal maintenance and exceeds up times records of legacy CVD and PVD equipment.
Chemistries: Cost-effective ALD of films including ZrO2, Al2O3, ZnO, ZnAlO, ZnBO, SiO2, TiO2, TiAlO, TiN, BN, Nb3N5 and more. Seamless and reproducible film engineering with nanolaminate and nanocomposite capabilities, adhesion in excess of 1000 PSI to many different substrates including tin, gold, copper, FR4, polyimides, many different solder mask materials, polyurethanes, ceramics, adhesives and more.
ApplicAtions: • Electronic devices • Sensors, OLED displays
• PCBs, CoBs, ICs and modules
• Medical devices and sensors
• Optical coatings
• Display and Solar technology
• Photo-catalytic coatings
• Encapsulation for environmental, corrosion, and high voltage insulation
Design: HELIOS accommodates parts with many different shapes and sizes with the combination of modular, parts-specific tooling and a generic loader. Standard chamber size from 1.5-80 liters or up to 1m X 1m panels (custom sizes available).
Temperature Window: 50 – 200 °C
Liquid Chemical Inlets: Up to 4
Gaseous Chemical Inlets: Up to 4
Footprint: 30′ L x 16′ W x 14′ H
Capacity: Up to 300 Liters of powdered substrate
Substrate Handling: Automated Inert Loading