The Benefits of Atomic Layer Deposition Coatings on Semiconductors
Advances in Atomic Layer Deposition (ALD) technology have enabled ultra-thin conformal coatings on semiconductor wafers and components. This technique provides incredible precise thickness control and robust film properties and in many ways is superior to CVD and PVD coating technology.
With ALD solutions and equipment from Forge Nano, this process is faster, more efficient and more cost effective than ever before. Semiconductor fabricators can benefit from Forge Nano ALD-Cap technology to create hermetic, pin-hole free, low stress thin films that offer excellent uniformity and precision for a range of applications, from 75-200mm wafers to fully assembled semiconductor packages ready for hermetic packaging.
Semiconductor Coating Solutions
Forge Nano’s ALDX technology has various applications in the semiconductor industry.
Benefits of ALD over CVD and PVD
Alternatives to ALD include Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD), however thanks to Forge Nano’s pioneering research and technological advancements, ALD can produce coatings of superior quality, with a thinner film and improved precursor consumption efficiency. This is extremely beneficial when it comes to semiconductor applications as the industry continues to evolve to greater die density and lighter weight packaging with increased sensitivity to environmental conditions
Forge Nano ALD Solutions
- Proof of concept – our team develops an ALD coating solution for testing purposes
- Developer agreements – we test and refine the process using our in-house equipment
- Toll coating services – your products or components are delivered to us for ALD coating
- Forge Nano ALDX Equipment – add our proprietary ALD coating machines to your production line
Download one of our application white papers to learn more about a sub-selection of published results.
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